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Low temperature cured epoxy adhesive
Low temperature cured epoxy adhesive
Low temperature cured epoxy adhesive
Low temperature cured epoxy adhesive

Low temperature cured epoxy adhesive


HX-8500/8600 is a single component low-temperature curing epoxy adhesive that can be applied to many materials, with excellent insulation properties and excellent adhesion. Especially suitable for components that are sensitive to heat and require low-temperature curing. Typical applications include Camera modules, Finger Print Sensors, Wearable Electronics, etc.


project

HX-8500

HX-8600

appearance

Black liquid

Purple red liquid

Specific gravity g/cm ³

1.25

1.31

Viscosity @ 25C, cps

15000±3000

30000±6000

curing temperature

100: 10 minutes
 85
: 20 minutes

100: 15 minutes

 85: 30 minutes

Hardness, Shore D

60

80

Glass transition temperature (Tg)

31

45

Coefficient of thermal expansion (CTE)

1=56 ppm/℃      2=160ppm/℃

1=48 ppm/

2=110 ppm/

Storage modulus @27oC, MPa

280 Mpa

550 Mpa

Tensile strength, Mpa

5 Mpa

10 Mpa

lap shear strength

15 MPa

22 MPa

Water absorption rate

<0.5 %

<0.5 %

Volumetric resistance

5.2x1014 Ohm/cm

1.6x1014 Ohm/cm

Surface resistance

1.9x1015 Ohm

8.8x1014 Ohm


List of Main Performance Parameters

state

project

Parameter performance

Before curing

Appearance of component A

Yellow transparent liquid

Component A viscosity, 25 ℃, mPa. s

500~1500

Appearance of component B

Countless transparent liquids

Component B viscosity, 25 ℃, mPa. s

2000~3000

Curing and shaping

appearance

Light yellow transparent

Hardness, Shore A

70~80

Tensile strength MPa

>5

elongation at break

>500

Water absorption rate%

<2

Volume resistance Ω

1.0*1012

Thermal conductivity coefficient W/(m * k)

0.1~0.2

Halogen ppm

<1000

VOC ppm

<1000